Patent Assignment
Reel/Frame 010331/0554
Assignment of Assignor's Interest
Recorded: 1999-10-09
Pages: 2
Assignee
ASAHI KASEI KOGYO KABUSHIKI KAISHA
2-6, DOJIMAHAMA 1-CHOME, KITA-KU, OSAKA-SHI, OSAKA 530-8205, JAPAN
Covered Property
(1)
Wiring Forming Method for Semiconductor Device and Semiconductor Device
Patent:
6,384,484 →
Application:
09/380,780 →
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.