Patent Assignment
Reel/Frame 010551/0961
Assignment of Assignor's Interest
Recorded: 1999-12-21
Pages: 2
Assignor
JIANG, TONGBI
Executed: 1999-12-03
Assignee
MICRON TECHNOLOGY, INC.
8000 SOUTH FEDERAL WAY, BOISE, IDAHO, 83707
Covered Property
(1)
Die Attach Material for Tbga or Flexible Circuitry
Patent:
7,019,410 →
Application:
09/471,071 →
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.