Patent Assignment
Reel/Frame 010581/0378
Assignment of Assignor's Interest
Recorded: 2000-01-27
Pages: 3
Assignor
SAITO, HIROKAZU
Executed: 2000-01-24
Assignee
CASIO COMPUTER CO., LTD.
6-2, HON-MACHI 1-CHOME, SHIBUYA-KU, TOKYO, JAPAN
Covered Property
(1)
"Flexible Wiring Substrate and Its Manufacturing Method"
Patent:
6,320,135 →
Application:
09/493,936 →
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 26, 2019
From: CASIO COMPUTER CO., LTD.
To: THOMSON LICENSING LLC
Reel/Frame 049601/0652 →
Assignment of Assignor's Interest
Jun 26, 2019
From: THOMSON LICENSING LLC
To: THOMSON LICENSING
Reel/Frame 049601/0666 →
Assignment of Assignor's Interest
Jun 26, 2019
From: THOMSON LICENSING
To: INTERDIGITAL CE PATENT HOLDINGS
Reel/Frame 049603/0160 →