IP Library › Assignment 010590/0687
Patent Assignment
Reel/Frame 010590/0687

Assignment of Assignor's Interest

Recorded: 2000-02-23 Pages: 3
Assignors
KAWAHARA, TOSHIMI
Executed: 2000-02-02
MATSUKI, HIROHISA
Executed: 2000-02-02
SHINMA, YASUHIRO
Executed: 2000-02-02
YONEDA, YOSHIYUKI
Executed: 2000-02-02
FUKASAWA, NORIO
Executed: 2000-02-02
HAMANAKA, YUZO
Executed: 2000-02-02
NAGASHIGE, KENICHI
Executed: 2000-02-02
HOZUMI, TAKASHI
Executed: 2000-02-02
Assignees
FUJITSU LIMITED
1-1, KAMIKODANAKA 4-CHOME, NAKAHARA-KU, KAWASAKI-SHI, KANAGAWA 211-8588, JAPAN
FUJITSU AUTOMATION LIMITED
1-1, KAMIKODANAKA 4-CHOME, NAKAHARA-KU, KAWASAKI-SHI, KANAGAWA 211-8588, JAPAN
Covered Property (1)
Method of Producing Semiconductor Devices Having Easy Separability from a Metal Mold After Molding
Patent: 6,511,620 →
Application: 09/511,496 →
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Feb 13, 2009
From: FUJITSU LIMITED
To: FUJITSU MICROELECTRONICS LIMITED
Reel/Frame 022248/0533 →
Assignment of Assignor's Interest Feb 25, 2009
From: FUJITSU AUTOMATION LIMITED
To: FUJITSU MICROELECTRONICS LIMITED
Reel/Frame 022299/0993 →