Patent Assignment
Reel/Frame 022299/0993
Assignment of Assignor's Interest
Recorded: 2009-02-25
Pages: 2
Assignor
FUJITSU AUTOMATION LIMITED
Executed: 2008-12-17
Assignee
FUJITSU MICROELECTRONICS LIMITED
7-1, NISHI-SHINJUKU 2-CHOME, SHINJUKU-KU, TOKYO,, 163-0722, JAPAN
Covered Property
(1)
Method of Producing Semiconductor Devices Having Easy Separability from a Metal Mold After Molding
Patent:
6,511,620 →
Application:
09/511,496 →
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Feb 23, 2000
From: KAWAHARA, TOSHIMI; MATSUKI, HIROHISA; SHINMA, YASUHIRO; YONEDA, YOSHIYUKI
To: FUJITSU LIMITED; FUJITSU AUTOMATION LIMITED
Reel/Frame 010590/0687 →
Assignment of Assignor's Interest
Feb 13, 2009
From: FUJITSU LIMITED
To: FUJITSU MICROELECTRONICS LIMITED
Reel/Frame 022248/0533 →