Patent Assignment
Reel/Frame 010617/0829
Assignment of Assignor's Interest
Recorded: 2000-02-15
Pages: 4
Assignee
VLSI TECHNOLOGY, INC.
1109 MCKAY DRIVE, SAN JOSE, CALIFORNIA, 95131
Covered Property
(1)
Method for eliminating stress induced dislocations in cmos devices
Patent:
6,221,735 →
Application:
09/504,991 →
Related Assignments
(9)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 20, 2006
From: PHILIPS ELECTRONICS NORTH AMERICA CORP.
To: NXP B.V.
Reel/Frame 018654/0521 →
Change of Name
Dec 2, 2009
From: VLSI TECHNOLOGY, INC.
To: PHILIPS SEMICONDUCTORS VLSI INC.
Reel/Frame 023586/0375 →
Merger
Dec 2, 2009
From: PHILIPS SEMICONDUCTORS INC.
To: PHILIPS SEMICONDUCTORS VLSI INC.
Reel/Frame 023586/0392 →
Change of Name
Dec 2, 2009
From: PHILIPS SEMICONDUCTORS VLSI INC.
To: PHILIPS SEMICONDUCTORS INC.
Reel/Frame 023586/0428 →
Merger
Dec 2, 2009
From: TRIMEDIA TECHNOLOGIES, INC.
To: PHILIPS SEMICONDUCTORS INC.
Reel/Frame 023586/0436 →
Assignment of Assignor's Interest
Dec 2, 2009
From: KONINKLIJKE PHILIPS ELECTRONICS N.V.; PHILIPS SEMICONDUCTORS INC.
To: NXP B.V.
Reel/Frame 023586/0439 →
Assignment of Assignor's Interest
Jan 10, 2012
From: NXP SEMICONDUCTORS N.V. ON BEHALF OF ITSELF AND ITS SUBSIDIARIES, INCLUDING NXP B.V.
To: INVENSAS CORPORATION
Reel/Frame 027545/0060 →
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →