IP Library › Assignment 023586/0439
Patent Assignment
Reel/Frame 023586/0439

Assignment of Assignor's Interest

Recorded: 2009-12-02 Pages: 6
Assignors
PHILIPS SEMICONDUCTORS INC.
Executed: 2009-11-19
Assignee
NXP B.V.
HIGH TECH CAMPUS 60, EINDHOVEN, 5656 AG, NETHERLANDS
Covered Properties (5)
Method for eliminating stress induced dislocations in cmos devices
Patent: 6,221,735 →
Application: 09/504,991 →
System and Method for Automatic Frequency Control in Spread Spectrum Communications
Patent: 6,728,301 →
Application: 09/612,536 →
Folded Ptat Current Sourcing
Patent: 6,417,724 →
Application: 09/747,121 →
Publication: US 2002/0079953
Replacing VLIW operation with equivalent operation requiring fewer issue slots
Patent: 6,886,091 →
Application: 09/895,473 →
Method and Apparatus for Scheduling Cell Search in Cdma Mobile Receivers
Patent: 7,089,004 →
Application: 10/198,240 →
Publication: US 2004/0023634
Related Assignments (19)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Feb 15, 2000
From: MANLEY, MARTIN; NOURI, FARAN
To: VLSI TECHNOLOGY, INC.
Reel/Frame 010617/0829 →
Assignment of Assignor's Interest Jul 7, 2000
From: CHRISIKOS, GEORGE
To: DOT WIRELESS, INC.; VLSI TECHNOLOGY, INC.
Reel/Frame 010971/0172 →
Assignment of Assignor's Interest Mar 23, 2001
From: TAYLOR, CLIVE ROLAND
To: PHILIPS SEMICONDUCTOR, INC.
Reel/Frame 011657/0899 →
Assignment of Assignor's Interest Feb 12, 2002
From: VISSERS, KORNELIS A.; TROMP, MARCEL J.A.; EIJNDHOVEN, JOS VAN
To: TRIMEDIA TECHNOLOGIES, INC.
Reel/Frame 012605/0287 →
Assignment of Assignor's Interest Jul 18, 2002
From: JEONG, GIBONG; LIEU, JUNCHENG; LUKER, GREG W.
To: TEXAS INSTRUMENTS INCORPORATED
Reel/Frame 013134/0398 →
Assignment of Assignor's Interest Dec 20, 2006
From: PHILIPS ELECTRONICS NORTH AMERICA CORP.
To: NXP B.V.
Reel/Frame 018654/0521 →
Merger Dec 2, 2009
From: TRIMEDIA TECHNOLOGIES, INC.
To: PHILIPS SEMICONDUCTORS INC.
Reel/Frame 023586/0436 →
Change of Name Dec 2, 2009
From: VLSI TECHNOLOGY, INC.
To: PHILIPS SEMICONDUCTORS VLSI INC.
Reel/Frame 023586/0375 →
Merger Dec 2, 2009
From: PHILIPS SEMICONDUCTORS INC.
To: PHILIPS SEMICONDUCTORS VLSI INC.
Reel/Frame 023586/0392 →
Change of Name Dec 2, 2009
From: PHILIPS SEMICONDUCTORS VLSI INC.
To: PHILIPS SEMICONDUCTORS INC.
Reel/Frame 023586/0428 →
Merger May 12, 2011
From: TRIMEDIA TECHNOLOGIES, INC.
To: PHILIPS SEMICONDUCTORS, INC.
Reel/Frame 026265/0840 →
Confirmatory Assignment Jun 8, 2011
From: KONINKLIJKE PHILIPS ELECTRONICS N.V.; PHILIPS SEMICONDUCTORS INC.
To: NXP B.V.
Reel/Frame 026409/0752 →
Assignment of Assignor's Interest Jul 22, 2011
From: NXP B.V.
To: NYTELL SOFTWARE LLC
Reel/Frame 026634/0532 →
Assignment of Assignor's Interest Jan 10, 2012
From: NXP SEMICONDUCTORS N.V. ON BEHALF OF ITSELF AND ITS SUBSIDIARIES, INCLUDING NXP B.V.
To: INVENSAS CORPORATION
Reel/Frame 027545/0060 →
Assignment of Assignor's Interest Apr 9, 2014
From: NXP B.V.
To: BREAKWATERS INNOVATIONS LLC
Reel/Frame 032642/0564 →
Security Interest Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Assignment of Assignor's Interest Sep 22, 2017
From: KONINKLIJKE PHILIPS ELECTRONICS N.V.
To: PHILIPS SEMICONDUCTORS INTERNATIONAL B.V.
Reel/Frame 043951/0127 →
Change of Name Sep 22, 2017
From: PHILIPS SEMICONDUCTORS INTERNATIONAL B.V.
To: NXP B.V.
Reel/Frame 043951/0611 →
Release of Security Interest Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →