Patent Assignment
Reel/Frame 010756/0794
Assignment of Assignor's Interest
Recorded: 2000-04-21
Pages: 6
Assignor
CIRCUIT COMPONENTS, INCORPORATED
Executed: 1994-10-13
Assignee
CIRCUIT COMPONENTS, INCORPORATED
2400 SOUTH ROOSEVELT STREET, TEMPE, ARIZONA, 85282
Covered Properties
(4)
High Capacitance Bus Bar and Method of Manufacture Thereof
Patent:
4,420,653 →
Application:
06/154,376 →
Electrical Circuit Board Interconnect
Patent:
4,793,814 →
Application:
06/887,260 →
Array Connector
Patent:
5,245,751 →
Application:
07/782,608 →
Method for Filling Vias in Ceramic Substrates with Composite Metallic Paste
Patent:
5,707,575 →
Application:
08/282,055 →
Related Assignments
(5)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignors Interest.
Jul 21, 1986
From: ZIFCAK, MARK S.; KOSA, BRUGE G.
To: ROGERS CORPORATION
Reel/Frame 004582/0973 →
Assignment of Assignors Interest.
Jan 13, 1992
From: LOCKE, BARBARA E.; BURDICK, LYNN E.; OWENS, MARK J.; ST. LAWRENCE, MICHAEL
To: ROGERS CORPORATION A MA CORPORATION
Reel/Frame 005967/0388 →
Assignment of Assignors Interest.
Mar 8, 1993
From: ROGERS CORPORATION
To: CIRCUIT COMPONENTS, INCORPORATED
Reel/Frame 006441/0735 →
Assignment of Assignors Interest.
Mar 8, 1993
From: ROGERS CORPORATION
To: CIRCUIT COMPONENTS, INCORPORATED
Reel/Frame 006445/0854 →
Assignment of Assignor's Interest
Jul 28, 1994
From: LITT, DAVID K.; HERNANDEZ, JORGE M.
To: MICRO SUBSTRATES CORPORATION
Reel/Frame 007104/0194 →