Patent Assignment
Reel/Frame 006445/0854
Assignment of Assignors Interest.
Recorded: 1993-03-08
Pages: 5
Assignor
ROGERS CORPORATION
Executed: 1992-03-30
Assignee
CIRCUIT COMPONENTS, INCORPORATED
2400 SOUTH ROOSEVELT, TEMPE, ARIZONA, 85282
Covered Properties
(30)
Layer-Built Laminated Bus Embedding Condensers
Patent:
4,266,091 →
Application:
05/950,266 →
Signal Cancelling Device
Patent:
4,236,048 →
Application:
06/001,139 →
High Capacitance Multilayer Bus Bar and Method of Manufacture Thereof
Patent:
4,236,038 →
Application:
06/059,068 →
Laminated Bus Bar and Method of Manufacture
Patent:
4,342,881 →
Application:
06/154,375 →
High Capacitance Bus Bar and Method of Manufacture Thereof
Patent:
4,420,653 →
Application:
06/154,376 →
Decoupling Capacitor and Method of Manufacture Thereof
Patent:
4,475,143 →
Application:
06/456,654 →
Decoupled Integrated Circuit Package
Patent:
4,636,918 →
Application:
06/683,344 →
Flat Decoupling Capacitor and Method of Manufacture Thereof
Patent:
4,584,627 →
Application:
06/690,117 →
Decoupling Capacitor and Method of Manufacture Thereof
Patent:
4,630,170 →
Application:
06/711,393 →
Decoupling Capacitor and Method of Manufacture Thereof
Patent:
4,622,619 →
Application:
06/711,478 →
Decoupling Capacitor for Surface Mounted Chip Carrier
Patent:
4,658,327 →
Application:
06/763,826 →
High Capacitance Bus Bar Including Multilayer Ceramic Capacitors
Patent:
4,599,486 →
Application:
06/773,431 →
Decoupling Capacitor for Pin Grid Array Package
Patent:
4,626,958 →
Application:
06/811,673 →
Decoupling Capacitor for Surface Mounted Leadless Chip Carrier, Surface Mounted Leaded Chip Carrier and Pin Grid Array Package
Patent:
4,734,819 →
Application:
07/027,739 →
Decoupling Capacitor for Leadless Surface Mounted Chip Carrier
Patent:
4,754,366 →
Application:
07/027,932 →
Decoupling Capacitor for Surface Mounted Leadless Chip Carriers, Surface Mounted Leaded Chip Carriers and Pin Grid Array Packages
Patent:
4,734,818 →
Application:
07/028,172 →
Decoupling Capacitor and Method of Formation Thereof
Patent:
4,748,537 →
Application:
07/094,441 →
Temperature Stable Multilayer Capacitor
Patent:
4,873,612 →
Application:
07/226,601 →
Low Inductance Decoupling Capacitor
Patent:
4,853,826 →
Application:
07/226,602 →
High Dielectric Constant Flexible Sheet Material
Patent:
4,908,258 →
Application:
07/226,619 →
Low Impedance Bus Bar
Patent:
5,051,542 →
Application:
07/291,514 →
High Dielectric Multilayer Capacitor
Patent:
4,853,827 →
Application:
07/291,520 →
Multilayer Printed Wiring Board
Patent:
5,065,284 →
Application:
07/291,531 →
Molded Integrated Circuit Package Incorporating Thin Decoupling Capacitor
Patent:
4,989,117 →
Application:
07/479,071 →
Molded Integrated Circuit Package Incorporating Heat Sink
Patent:
5,065,281 →
Application:
07/479,073 →
Integrated Circuit Package Having an Internal Cavity for Incorporating Decoupling Capacitor
Patent:
5,272,590 →
Application:
07/479,074 →
Molded Integrated Circuit Package Incorporating Decoupling Capacitor
Patent:
4,994,936 →
Application:
07/479,075 →
Thin Decoupling Capacitor for Mounting Under Integrated Circuit Package
Patent:
5,034,850 →
Application:
07/479,095 →
Internally Decoupled Integrated Circuit Package
Patent:
5,095,402 →
Application:
07/591,778 →
High Dielectric Constant Sheet Material
Patent:
5,185,690 →
Application:
07/778,683 →
Related Assignments
(18)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignors Interest.
Jan 10, 1983
From: HERNANDEZ, JORGE M.
To: ROGERS CORPORATION, A CORP. OF MASS.
Reel/Frame 004085/0694 →
Assignment of Assignors Interest.
Dec 19, 1984
From: JODOIN, RAYMOND C.
To: ROGERS CORPORATION
Reel/Frame 004356/0677 →
Assignment of Assignors Interest.
Jan 9, 1985
From: SCHILLING, DONALD P.; JODOIN, RAYMOND C.; JOHNSTON, JOSEPH E.
To: ROGERS CORPORATION
Reel/Frame 004360/0371 →
Assignment of Assignors Interest.
Mar 13, 1985
From: SCHILLING, DONALD P.; JODOIN, RAYMOND C.; JOHNSTON, JOSEPH E.
To: ROGERS CORPORATION
Reel/Frame 004383/0353 →
Assignment of Assignors Interest.
Mar 13, 1985
From: KASK, ESTER M. ON BEHALF OF AND AS EXECUTRIX OF THE ESTATE OF EUGENE KASK, DEC'D
To: ROGERS CORPORATION
Reel/Frame 004383/0309 →
Assignment of Assignors Interest.
Aug 8, 1985
From: HERNANDEZ, JORGE M.
To: ROGERS CORPORATION
Reel/Frame 004442/0614 →
Assignment of Assignors Interest.
Sep 6, 1985
From: HERRANDEZ, JORGE M.
To: ROGERS CORPORATION, A CORP. OF MA.
Reel/Frame 004454/0104 →
Assignment of Assignors Interest.
Aug 1, 1988
From: HERNANDEZ, JORGE M.
To: ROGERS CORPORATION, A CORP. OF MASSACHUSETTS
Reel/Frame 004930/0074 →
Assignment of Assignors Interest.
Aug 1, 1988
From: HERNANDEZ, JORGE M.
To: ROGERS CORPORATION, A CORP. OF MA
Reel/Frame 004927/0284 →
Assignment of Assignors Interest.
Aug 1, 1988
From: HERNANDEZ, JORGE M.
To: ROGERS CORPORATION, ROGERS, CT., 06263, A CORP OF MA.
Reel/Frame 004920/0814 →
Assignment of Assignors Interest.
Dec 8, 1988
From: ALCAZAR, ANTONIO
To: ROGERS CORPORATION, A CORP. OF MA
Reel/Frame 004983/0671 →
Assignment of Assignors Interest.
Dec 29, 1988
From: HERNANDEZ, JORGE M.
To: ROGERS CORPORATION
Reel/Frame 005423/0442 →
Assignment of Assignors Interest.
Dec 29, 1988
From: HERNANDEZ, JORGE M.
To: ROGERS CORPORATION, A CORP. OF MA
Reel/Frame 005015/0095 →
Assignment of Assignors Interest.
Dec 29, 1988
From: HERNANDEZ, JORGE M.
To: ROGERS CORPORATION, A CORP. OF MA
Reel/Frame 005015/0114 →
Assignment of Assignors Interest.
Feb 12, 1990
From: HERNANDEZ, JORGE M.; SIMPSON, SCOTT
To: ROGERS CORPORATION
Reel/Frame 005247/0423 →
Assignment of Assignors Interest.
Feb 12, 1990
From: HERNANDEZ, JORGE M.
To: ROGERS CORPORATION, A CORP. OF MA
Reel/Frame 005231/0858 →
Assignment of Assignor's Interest
Aug 5, 1996
From: FAIRCHILD SEMICONDUCTOR CORPORATION
To: NATIONAL SEMICONDUCTOR CORPORATION
Reel/Frame 008059/0846 →
Assignment of Assignor's Interest
Apr 21, 2000
From: CIRCUIT COMPONENTS, INCORPORATED
To: CIRCUIT COMPONENTS, INCORPORATED
Reel/Frame 010756/0794 →