Granted Patent
Utility
US 5,065,281 · App. 07/479,073
Molded integrated circuit package incorporating heat sink
Inventors:
Jorge M. Hernandez, Scott S. Simpson
Patented Case
View Patent ↗
Granted: Nov 12, 1991
Filed: Feb 12, 1990
Inventors
Jorge M. Hernandez
Scott S. Simpson
Assignee (at issue)
ROGERS CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.