Patent Assignment
Reel/Frame 010874/0343
Assignment of Assignor's Interest
Recorded: 2000-06-06
Pages: 3
Assignors
TONG, QIN-YI
Executed: 2000-03-06
FOUNTAIN, GAIUS GILLMAN JR.
Executed: 2000-03-09
ENQUIST, PAUL M.
Executed: 2000-03-06
Assignee
RESEARCH TRIANGLE INSTITUTE
3040 CORNWALLIS ROAD, RESEARCH TRIANGLE PARK, NORTH CAROLINA, 27709
Covered Property
(1)
Method for Low Temperature Bonding and Bonded Structure
Patent:
6,902,987 →
Application:
09/505,283 →
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 25, 2001
From: RESEARCH TRIANGLE INSTITUTE
To: ZIPTRONIX, INC.
Reel/Frame 012002/0970 →
Assignment of Assignor's Interest
Mar 12, 2003
From: TONG, QIN-YI; FOUNTAIN, GAIUS GILLMAN, JR.; ENQUIST, PAUL M.
To: RESEARCH TRIANGLE INSTITUTE
Reel/Frame 013838/0441 →
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Change of Name
Jun 28, 2017
From: ZIPTRONIX , INC.
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 043029/0657 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →