Patent Assignment
Reel/Frame 010876/0207
Assignment of Assignor's Interest
Recorded: 2000-05-11
Pages: 2
Assignee
T.I.F. CO., LTD.
5-6-213, SAN-NO 2-CHOME, OHTA-KU, TOKYO, 143-0, JAPAN
Covered Property
(1)
Semiconductor Device and Method for Manufacturing the Same
Patent:
6,281,026 →
Application:
09/554,418 →
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger
Sep 3, 2002
From: T.I.F. CO., LTD.
To: NIIGATA SEIMITSU CO., LTD.
Reel/Frame 013248/0283 →
Change of Name
Oct 22, 2009
From: NIIGATA SEIMITSU CO., LTD.
To: NSC CO., LTD.
Reel/Frame 023401/0947 →
Assignment of Assignor's Interest
Jan 20, 2010
From: NSC CO., LTD.
To: TESSERA INTELLECTUAL PROPERTIES, INC.
Reel/Frame 023821/0070 →
Change of Name
Jun 8, 2011
From: TESSERA INTELLECTUAL PROPERTIES, INC.
To: INVENSAS CORPORATION
Reel/Frame 026423/0286 →
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →