IP Library Assignment 023821/0070
Patent Assignment
Reel/Frame 023821/0070

Assignment of Assignor's Interest

Recorded: 2010-01-20 Pages: 9
Assignor
NSC CO., LTD.
Executed: 2009-11-09
Assignee
TESSERA INTELLECTUAL PROPERTIES, INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Properties (8)
Semiconductor Device Having Magnetic Shield Layer Circumscribing The Device
Patent: 6,097,080 →
Application: 09/171,455 →
Memory Module
Patent: 6,208,546 →
Application: 09/284,614 →
Semiconductor Device and Method for Manufacturing the Same
Patent: 6,281,026 →
Application: 09/554,418 →
Semiconductor Device and Method for Manufacturing the Same
Patent: 6,291,309 →
Application: 09/554,632 →
Method for Manufacturing Semiconductor Device
Patent: 6,479,306 →
Application: 09/716,165 →
Semiconductor Device and Method for Manufacturing the Same
Patent: 6,969,623 →
Application: 09/716,843 →
Memory System
Patent: 7,055,072 →
Application: 10/181,278 →
Publication: US 2004/0225928
Semiconductor Device
Patent: 6,858,946 →
Application: 10/482,012 →
Publication: US 2004/0173911
Related Assignments (8)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 23, 2003
From: MIYAGI, HIROSHI; OKAMOTO, AKIRA
To: NIIGATA SEIMITSU CO., LTD.
Reel/Frame 015353/0201 →
Assignment of Assignor's Interest Jul 11, 2005
From: OKAMURA, SUSUMU; IKEDA, TAKESHI
To: NIIGATA SEIMITSU CO., LTD.
Reel/Frame 016237/0933 →
Change of Name Oct 15, 2009
From: NIIGATA SEIMITSU CO., LTD.
To: NSC CO, LTD.
Reel/Frame 023373/0610 →
Change of Name Oct 22, 2009
From: NIIGATA SEIMITSU CO., LTD.
To: NSC CO., LTD.
Reel/Frame 023401/0947 →
Change of Name Jun 8, 2011
From: TESSERA INTELLECTUAL PROPERTIES, INC.
To: INVENSAS CORPORATION
Reel/Frame 026423/0286 →
Security Interest Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Security Interest Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Release of Security Interest Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →