Semiconductor device and method for manufacturing the same
View Patent ↗A semiconductor device and a method for manufacturing the semiconductor device mountable with high density, which includes a simplified process but is capable of reducing a defect rate. A plurality of identical memory chips are formed on a semiconductor wafer, and a go/no-go test is conducted on all the memory chips. The semiconductor wafer is cut and divided into pieces that each consists of one, or two, or four good memory chips, and they are mounted on a substrate to form a memory module.
1. A method for manufacturing the semiconductor device, comprising:
a first step of forming a plurality of identical semiconductor chips on a semiconductor wafer;
a second step of carrying out a quality test for each of a plurality of said semiconductor chips formed on said semiconductor wafer; and
a third step of dividing one of a plurality of pieces of said semiconductor chips on the basis of a result of said quality test,
wherein said plurality of semiconductor chips are divided into first groups made of four pieces if four pieces are determined to be possible to form a group as a result of said step of carrying out a quality test, but wherein said chips are divided into second groups made of two pieces if four pieces are determined to be not possible to form a group as a result of said step of carrying out a quality test but if two pieces are determined to be possible, and wherein said chips are divided into third groups made of one piece if neither four pieces nor two pieces are determined to be possible to form a group as a result of said step of carrying out a quality test but if one piece is determined to be possible as a result of said quality test.
2. The method for manufacturing the semiconductor device according to claim 1 , wherein said semiconductor chips are memory chips.
3. A method for manufacturing the semiconductor device, comprising:
a first step of forming a plurality of identical semiconductor ships on a semiconductor wafer;
a second step of carrying out wiring, resin sealing, terminal formation for a plurality of said semiconductor chips formed on said semiconductor wafer;
a third stop of carrying out a quality test of each of a plurality of said semiconductor chips, which is formed on said semiconductor wafer, by using said terminal formed by said second step; and
a fourth step of dividing one or a plurality of said semiconductor chips on the basis of a result of said quality test,
wherein said plurality of semiconductor chips are divided into first groups made of four pieces if four pieces are determined to be possible to form a group as a result of said step of carrying out a quality test, but wherein said chips are divided into second groups made of two pieces if four pieces are determined to be not possible to form a group as a result of said step of carrying out a quality test but if two pieces are determined to be possible, and wherein said chips are divided into third groups made of one piece if neither four pieces nor two pieces are determined to be possible to form a group as a result of said step of carrying out a quality test but if one piece is determined to be possible, after said quality test is carried out.
4. The method for manufacturing the semiconductor device according to claim 3 , wherein said semiconductor chips are memory chips.