Patent Assignment
Reel/Frame 011040/0396
Assignment of Assignor's Interest
Recorded: 2000-09-01
Pages: 3
Assignor
CHAU, KELVIN
Executed: 2000-08-18
Assignee
ONIX MICROSYSTEMS, INC.
4138 LAKESIDE DRIVE, RICHMOND, CALIFORNIA, 94801
Covered Property
(1)
Apparatus and packaging method to assemble optical modules to a common substrate with adjustable plugs
Patent:
6,375,365 →
Application:
09/514,424 →
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.