Assignment of Assignor's Interest

Recorded: 2000-08-25 Pages: 3

Assignor

IGUCHI, MANABU

Executed: 2000-08-11

Assignee

NEC CORPORATION

7-1, SHIBA 5-CHOME, MINATO-KU, TOKYO, JAPAN

Covered Property (1)

Method of forming a copper interconnection on a semiconductor wafer

Patent: 6,376,363 →

Application: 09/645,498 →

Related Assignments (2)

Other recorded transfers of the patent in this record — the chain of ownership.