Patent Assignment
Reel/Frame 011054/0594
Assignment of Assignor's Interest
Recorded: 2000-08-24
Pages: 2
Assignor
MATSUO, NOBUYUKI
Executed: 2000-08-23
Assignee
NEC CORPORATION
MINATO-KU, 7-1, SHIBA 5-CHOME, TOKYO, JAPAN
Covered Property
(1)
Ccd Mold Package with Improved Heat Radiation Structure
Patent:
6,525,409 →
Application:
09/644,695 →
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
May 13, 2003
From: NEC CORPORATION
To: NEC ELECTRONICS CORPORATION
Reel/Frame 013650/0079 →
Change of Name
Nov 18, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025375/0909 →
Change of Address
Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →