Patent Assignment
Reel/Frame 011078/0390
Security Agreement
Recorded: 2000-09-08
Pages: 6
Assignor
FIDELICA MICROSYSTEMS, INC.
Executed: 2000-07-19
Assignee
SILICON VALLEY BANK
LOAN DOCUMENTATION HG150, 3003 TASMAN DR., SANTA CLARA, CALIFORNIA, 95054
Covered Properties
(3)
Magnetoresistive Semiconductor Pressure Sensors and Fingerprint Identification/Verification Sensors Using Same
Patent:
6,889,555 →
Application:
09/500,706 →
Use of Multi-Layer Thin Films as Stress Sensor
Patent:
6,694,822 →
Application:
09/502,406 →
Method and Apparatus for Pressure Sensing
Patent:
6,578,436 →
Application:
09/571,765 →
Related Assignments
(9)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
May 15, 2000
From: GANAPATHI, SRINIVASAN K.
To: FIDELICA MICROSYSTEMS, INC.
Reel/Frame 010797/0145 →
Assignment of Assignor's Interest
May 16, 2000
From: GANAPATHI, SRINIVASAN K.; PRAKASH, SHIVA
To: FIDELICA MICROSYSTEMS, INC.
Reel/Frame 010797/0130 →
Assignment of Assignor's Interest
Oct 6, 2000
From: GANAPATHL, SRINVASAN K.; GLUCK, RANDOLPH S.; HOVEY, STEVEN H.; PRAKASH, SHIVA
To: FIDELICA MICROSYSTEMS, INC.
Reel/Frame 011252/0661 →
Release
Mar 2, 2004
From: SILICON VALLEY BANK
To: FIDELICA MICROSYSTEMS, INC.
Reel/Frame 015025/0549 →
Security Agreement
Feb 22, 2007
From: FIDELICA MICROSYSTEMS, INC.
To: SPRING WORKS, LLC
Reel/Frame 018917/0401 →
Assignment of Assignor's Interest
Aug 6, 2008
From: FIDELICA MICROSYSTEMS, INC.
To: SPRINGWORKS, LLC
Reel/Frame 021344/0093 →
Release of Security Interest
Aug 12, 2008
From: SPRINGWORKS, LLC
To: FIDELICA MICROSYSTEMS, INC.
Reel/Frame 021371/0207 →
Assignment of Assignor's Interest
Dec 1, 2012
From: SPRINGWORKS, LLC
To: PALIOS CORPORATION
Reel/Frame 029389/0406 →
Assignment of Assignor's Interest
Jun 26, 2013
From: PALIOS CORPORATION
To: LENOVO PC INTERNATIONAL LIMITED
Reel/Frame 030694/0540 →