Assignment of Assignor's Interest

Recorded: 2000-09-13 Pages: 2

Assignor

HASHII, TOMOHIRO

Executed: 2000-06-26

Assignee

SUMITOMO METAL INDUSTRIES, LTD.

CHUO-KU, 5-33, KITAHAMA 4-CHOME, OSAKA-SHI, OSAKA, 541-0, JAPAN

Covered Property (1)

Semiconductor Wafer Grinding Method

Patent: 6,969,302 →

Application: 09/594,502 →

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.