Semiconductor wafer grinding method
View Patent ↗To reduce the wafer production cost by grinding a sliced semiconductor wafer at a high accuracy and a high efficiency and supplying the wafer to the next polishing step. A semiconductor wafer is rough ground between grindstones by a fixed grindstone. After rough grinding, finish grinding by free abrasive grain is performed on the same grinding axis by supplying a slurry which suspends fine abrasive grain between the grindstones through slurry pipes. To perform finish grinding by free abrasive grains, a rotational speed and a feed rate of the grindstones are lowered to lower the grinding action by a fixed grindstone.
1. A method for grinding semiconductor wafers comprising:
grinding a surface of a semiconductor wafer with fixed abrasive grains and without free abrasive grains;
supplying free abrasive grains to said fixed abrasive grains; and
subsequently grinding said surface of a semiconductor wafer with said fixed abrasive grains and said free abrasive grains, wherein
said fixed abrasive grains have a larger diameter than said free abrasive grains.
2. The method of claim 1 , wherein grinding includes at least one of both sides grinding of a semiconductor wafer and grinding of a chamfered portion.