Patent Assignment
Reel/Frame 011420/0590
Assignment of Assignor's Interest
Recorded: 2001-01-04
Received: 2001-01-17
Pages: 3
Assignee
MICRON TECHNOLOGY
POST OFFICE BOX 6, 8000 S. FEDERAL WAY, BOISE, ID, 83707, UNITED STATES
Covered Property
(1)
Method of Forming a Metal Seed Layer for Subsequent Plating
Application:
09/753,548 →