IP Library › Granted Patent US 6,489,235
Granted Patent Utility
US 6,489,235 · Confirmation No. 2644

METHOD OF FORMING A METAL SEED LAYER FOR SUBSEQUENT PLATING

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2010-07-07 N570 Communication - Re: Power of Attorney (PTOL-308) 1 View
2010-07-07 N570 Communication - Re: Power of Attorney (PTOL-308) 1 View
2010-06-23 PA.. Power of Attorney 1 View
2010-06-23 R3.73 Assignee showing of ownership per 37 CFR 3.73 1 View
2010-06-23 C.AD Change of Address 1 View
2010-06-23 N417 Electronic Filing System Acknowledgment Receipt 2 View
2010-06-23 TRAN.LET Transmittal Letter 2 View
2009-12-16 N570 Communication - Re: Power of Attorney (PTOL-308) 1 View
2009-12-16 N570 Communication - Re: Power of Attorney (PTOL-308) 1 View
2009-12-04 PA.. Power of Attorney 2 View
2009-12-04 R3.73 Assignee showing of ownership per 37 CFR 3.73 1 View
2009-12-04 LET. Miscellaneous Incoming Letter 1 View
2009-12-04 N417 Electronic Filing System Acknowledgment Receipt 2 View
2001-03-21 SPEC Specification 13 View
2001-03-21 CLM Claims 17 View
2001-03-21 ABST Abstract 1 View
2001-01-04 TRNA Transmittal of New Application 3 View
2001-01-04 A.PE Preliminary Amendment 5 View
2001-01-04 SPEC Specification 13 View
2001-01-04 CLM Claims 16 View
2001-01-04 ABST Abstract 1 View
2001-01-04 DRW Drawings-only black and white line drawings 5 View
2001-01-04 OATH Oath or Declaration filed 4 View
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Quick Facts
Patent No.
US 6,489,235
App. No.
09/753,548
Filed
2001-01-04
Granted
2002-12-03
Pub. No.
US20010011638A1
Art Unit
2814
PTA
0 days