Patent Assignment
Reel/Frame 011430/0116
Assignment of Assignor's Interest
Recorded: 2001-01-04
Received: 2001-01-18
Pages: 3
Assignors
BOYD, JOHN M.
Executed: 2001-01-02
GOTKIS, YEHIEL
Executed: 2001-01-02
KISTLER, ROD
Executed: 2001-01-02
Assignee
LAM RESEARCH CORPORATION
4650 CUSHING PARKWAY, FREMONT, CA, 94538, UNITED STATES
Covered Property
(1)
System and Method for Polishing and Planarizing Semiconductor Wafers Using Reduced Surface Area Polishing Pads and Variable Partial Pad-Wafer Overlapping Techniques
Application:
09/754,480 →