Patent Assignment
Reel/Frame 011459/0957
Assignment of Assignor's Interest
Recorded: 2001-01-12
Pages: 2
Assignors
IWASAKI, TOMIO
Executed: 2000-12-21
MIURA, HIDEO
Executed: 2000-12-22
NAKAJIMA, TAKASHI
Executed: 2000-12-22
OHTA, HIROYUKI
Executed: 2000-12-22
NISHIHARA, SHINJI
Executed: 2000-12-22
SAHARA, MASASHI
Executed: 2000-12-22
Assignee
HITACHI, LTD.
6, KANDA SURUGADAI 4-CHOME CHIYODA-KU, TOKYO, JAPAN
Covered Property
(1)
Semiconductor Device Having a Capacitor and an Interconnect Layer with Molydenum-Containing Tungsten