Assignment of Assignor's Interest

Recorded: 2001-01-30 Received: 2001-02-08 Pages: 6

Assignors

CHAI, KIAN LEE

Executed: 2001-01-04

HUI, CHIN CHONG

Executed: 2001-01-04

KUAN, CHOON LEE

Executed: 2001-01-04

Assignee

MICRON TECHNOLOGY, INC.

8000 SOUTH FEDERAL WAY, BOISE, ID, 83706, UNITED STATES

Covered Property (1)

Boc Semiconductor Package Including a Semiconductor Die and a Substrate Bonded Circuit Side Down to the Die

Application: 09/774,130 →