Granted Patent
Utility
US 6,507,114
· Confirmation No. 9901
BOC SEMICONDUCTOR PACKAGE INCLUDING A SEMICONDUCTOR DIE AND A SUBSTRATE BONDED CIRCUIT SIDE DOWN TO THE DIE
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⬇ PDF
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2001-01-30 | TRNA |
Transmittal of New Application | 2 | View | |
| 2001-01-30 | SPEC |
Specification | 17 | View | |
| 2001-01-30 | CLM |
Claims | 10 | View | |
| 2001-01-30 | ABST |
Abstract | 1 | View | |
| 2001-01-30 | DRW |
Drawings-only black and white line drawings | 5 | View | |
| 2001-01-30 | OATH |
Oath or Declaration filed | 3 | View | |
| 2001-01-30 | TRNA |
Transmittal of New Application | 2 | View | |
| 2001-01-30 | SPEC |
Specification | 17 | View | |
| 2001-01-30 | CLM |
Claims | 10 | View | |
| 2001-01-30 | ABST |
Abstract | 1 | View | |
| 2001-01-30 | DRW |
Drawings-only black and white line drawings | 5 | View | |
| 2001-01-30 | OATH |
Oath or Declaration filed | 3 | View |
Inventors
Chong Chin Hui
Singapore, SINGAPORE
Lee Choon Kuan
Singapore, SINGAPORE
Lee Kian Chai
Singapore, SINGAPORE
Attorneys & Agents of Record
Classification
USPC
257/738
H10W70/635
H10W90/701
H10W72/951
H10W72/075
H10W74/00
H10W72/5524
H10W74/129
Prosecution
- Examiner
- WARREN, MATTHEW E
- Art Unit
- 2815
- Customer No.
- 22823
- Docket No.
- 99-0966
- Confirmation No.
- 9901
Publication
- Pub. No.
- US20020100976A1
- Pub. Date
- 2002-08-01
Patent Term Adjustment
-8days
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2010-01-04
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2001-01-30
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Quick Facts
- Patent No.
- US 6,507,114
- App. No.
- 09/774,130
- Filed
- 2001-01-30
- Granted
- 2003-01-14
- Pub. No.
- US20020100976A1
- Examiner
- WARREN, MATTHEW E
- Art Unit
- 2815
- PTA
- -8 days
External Links