Patent Assignment
Reel/Frame 011488/0822
Assignment of Assignor's Interest
Recorded: 2001-01-29
Received: 2001-02-08
Pages: 3
Assignor
OKOROANYANWU, UZODINMA
Executed: 2001-01-24
Assignee
ADVANCED MICRO DEVICES, INC.
P.O. BOX 3453, ONE AMD PLACE, SUNNYVALE, CA, 94088, UNITED STATES
Covered Property
(1)
Process for Reducing the Pitch of Contact Holes, Vias, and Trench Structures in Integrated Circuits
Application:
09/771,820 →