Patent Assignment
Reel/Frame 011490/0495
Assignment of Assignor's Interest
Recorded: 2001-01-29
Received: 2001-02-08
Pages: 4
Assignors
AOKI, HIDEJI
Executed: 2001-01-11
HIROSE, TETSUYA
Executed: 2001-01-11
KATO, KIYOHARU
Executed: 2001-01-11
MISHIMA, YOSHIYUKI
Executed: 2001-01-11
UENO, TORU
Executed: 2001-01-11
YAMADA, HIROMICHI
Executed: 2001-01-11
Assignees
MITSUBISHI DENKI KABUSHIKI KAISHA
2-3, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO, JPX, 100-8, JAPAN
MITSUBISHI ELECTRIC ENGINEERING COMPANY LIMITED
6-2, OOTEMACHI 2-CHOME, CHIYODA-KU, TOKYO, JPX, 100-0, JAPAN
Covered Property
(1)
Mold for Resin-Sealing of Semiconductor Devices
Application:
09/770,666 →