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App. No. 09/770,666 · Confirmation No. 7041

MOLD FOR RESIN-SEALING OF SEMICONDUCTOR DEVICES

Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362 View Patent ↗ View Publication ↗
⬇ PDF
 Code Description Pages PDF
2001-01-29 TRNA Transmittal of New Application 2 View
2001-01-29 ADS Application Data Sheet 2 View
2001-01-29 A.PE Preliminary Amendment 22 View
2001-01-29 SPEC Specification 33 View
2001-01-29 CLM Claims 7 View
2001-01-29 ABST Abstract 1 View
2001-01-29 DRW Drawings-only black and white line drawings 7 View
2001-01-29 OATH Oath or Declaration filed 4 View
2001-01-29 TRNA Transmittal of New Application 2 View
2001-01-29 ADS Application Data Sheet 2 View
2001-01-29 A.PE Preliminary Amendment 22 View
2001-01-29 SPEC Specification 33 View
2001-01-29 CLM Claims 7 View
2001-01-29 ABST Abstract 1 View
2001-01-29 DRW Drawings-only black and white line drawings 7 View
2001-01-29 OATH Oath or Declaration filed 4 View
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Quick Facts
App. No.
09/770,666
Filed
2001-01-29
Granted
2003-03-11
Pub. No.
US20020012716A1
Art Unit
1722
PTA
-47 days