Patent Assignment
Reel/Frame 011493/0776
Assignment of Assignor's Interest
Recorded: 2001-01-16
Received: 2001-02-09
Pages: 3
Assignors
HSIEH, JA-RONG
Executed: 2000-11-01
LIU, PAO-KUO
Executed: 2000-11-01
WANG, ZHI-YONG
Executed: 2000-11-01
Assignee
PROMOS TECHNOLOGIES, INC.
SCIENCE BASED IND. PARK, NO. 19, LI HSIN ROAD, HSIN-CHU, TWX, R.O.C, TAIWAN
Covered Property
(1)
Addition of Planarizing Dielectric Layer to Reduce a Dishing Phenomena Experienced During a Chemical Mechanical Procedure Used in the Formation of Shallow Trench Isolation Regions
Application:
09/759,905 →