Patent Assignment
Reel/Frame 011578/0804
Assignment of Assignor's Interest
Recorded: 2001-02-14
Pages: 2
Assignor
YOSHIIKE, KAZUAKI
Executed: 2001-02-07
Assignee
OKI ELECTRIC INDUSTRY CO., LTD.
7-12, TORANOMON 1-CHOME, MINATO-KU, TOKYO 105, JAPAN
Covered Property
(1)
Molding Apparatus for Use in Manufacture of Resin Shielding Semiconductor Device
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.