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App. No. 09/782,163 · Confirmation No. 8312

MOLDING APPARATUS FOR USE IN MANUFACTURE OF RESIN SHIELDING SEMICONDUCTOR DEVICE

Inventor: Kazuaki Yoshiike
Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362 View Patent ↗ View Publication ↗
⬇ PDF
 Code Description Pages PDF
2001-02-14 TRNA Transmittal of New Application 2 View
2001-02-14 SPEC Specification 10 View
2001-02-14 CLM Claims 3 View
2001-02-14 ABST Abstract 1 View
2001-02-14 DRW Drawings-only black and white line drawings 8 View
2001-02-14 OATH Oath or Declaration filed 3 View
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Quick Facts
App. No.
09/782,163
Filed
2001-02-14
Granted
2003-03-04
Pub. No.
US20010016368A1
Art Unit
2823
PTA
0 days