Patent Application
Utility
App. No. 10/300,782
· Confirmation No. 7319
METHOD OF FORMING THE RESIN SEALED SEMICONDUCTOR DEVICE USING THE LEAD FRAME
Inventor:
Kazuaki Yoshiike
Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2003-11-21 | A.NA |
Amendment after Notice of Allowance (Rule 312) | 1 | View | |
| 2003-11-21 | SPEC |
Specification | 2 | View | |
| 2003-11-21 | REM |
Applicant Arguments/Remarks Made in an Amendment | 1 | View | |
| 2003-07-23 | IFEE |
Issue Fee Payment (PTO-85B) | 1 | View | |
| 2002-11-21 | TRNA |
Transmittal of New Application | 2 | View | |
| 2002-11-21 | A.PE |
Preliminary Amendment | 14 | View | |
| 2002-11-21 | SPEC |
Specification | 10 | View | |
| 2002-11-21 | CLM |
Claims | 3 | View | |
| 2002-11-21 | ABST |
Abstract | 1 | View | |
| 2002-11-21 | DRW |
Drawings-only black and white line drawings | 8 | View | |
| 2002-11-21 | OATH |
Oath or Declaration filed | 4 | View |
Inventors
Kazuaki Yoshiike
Miyazaki, JAPAN
Attorneys & Agents of Record
Classification
USPC
438/106
H10W74/016
H10W90/756
Prosecution
- Examiner
- PHAM, THANH V
- Art Unit
- 2823
- Customer No.
- 26071
- Docket No.
- F99ED0138-DIV
- Confirmation No.
- 7319
Foreign Priority
2000-044478
·
2000-02-22
·
JAPAN
Publication
- Pub. No.
- US20030062605A1
- Pub. Date
- 2003-04-03
Patent Term Adjustment
-121days
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Quick Facts
- App. No.
- 10/300,782
- Filed
- 2002-11-21
- Granted
- 2004-01-27
- Pub. No.
- US20030062605A1
- Examiner
- PHAM, THANH V
- Art Unit
- 2823
- PTA
- -121 days
External Links