IP Library › Assignment 011615/0946
Patent Assignment
Reel/Frame 011615/0946

ASSIGNMENT OF ASSIGNOR'S INTEREST

Recorded: 2001-03-07 Received: 2001-03-28 Pages: 2
Assignors
DESAI, KISHOR
Executed: 2001-03-05
RAJAGOPALAN, SARATHY
Executed: 2001-03-05
Assignee
LSI LOGIC CORPORATION
1551 MCCARTHY BOULEVARD, MILPITAS, CA, 95035, UNITED STATES
Covered Application (1)
METHOD FOR MANUFACTURING A DUAL CHIP IN PACKAGE WITH A FLIP CHIP DIE MOUNTED ON A WIRE BONDED DIE
App. No. 09/801,007
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