IP Library › Granted Patent US 6,518,161
Granted Patent Utility
US 6,518,161 · Confirmation No. 3853

METHOD FOR MANUFACTURING A DUAL CHIP IN PACKAGE WITH A FLIP CHIP DIE MOUNTED ON A WIRE BONDED DIE

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 Code Description Pages PDF
2022-04-15 OATH Oath or Declaration filed 236 View
2001-03-07 TRNA Transmittal of New Application 3 View
2001-03-07 SPEC Specification 5 View
2001-03-07 CLM Claims 5 View
2001-03-07 ABST Abstract 1 View
2001-03-07 DRW Drawings-only black and white line drawings 5 View
2001-03-07 OATH Oath or Declaration filed 3 View
2001-03-07 LET. Miscellaneous Incoming Letter 1 View
2001-03-07 TRNA Transmittal of New Application 3 View
2001-03-07 SPEC Specification 5 View
2001-03-07 CLM Claims 5 View
2001-03-07 ABST Abstract 1 View
2001-03-07 DRW Drawings-only black and white line drawings 5 View
2001-03-07 OATH Oath or Declaration filed 3 View
2001-03-07 LET. Miscellaneous Incoming Letter 1 View
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Quick Facts
Patent No.
US 6,518,161
App. No.
09/801,007
Filed
2001-03-07
Granted
2003-02-11
Art Unit
2822
PTA
0 days