Patent Assignment
Reel/Frame 011638/0381
Assignment of Assignor's Interest
Recorded: 2001-03-01
Received: 2001-04-04
Pages: 3
Assignors
IWAMATSU, TOSHIAKI
Executed: 2001-01-26
KATAKURA, TAKASHI
Executed: 2001-01-26
NARUOKA, HIDEKI
Executed: 2001-01-29
TAKAMATSU, MASARU
Executed: 2001-01-31
Assignees
MITSUBISHI MATERIALS SILICON CORPORATION
5-1, OHTEMACHI 1-CHOME, CHIYODA-KU, TOKYO 100-0004, JPX, JAPAN
MITSUBISHI DENKI KABUSHIKI KAISHA
2-3, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO 100-8310, JPX, JAPAN
Covered Property
(1)
Soi Substrate, Method of Manufacture Thereof, and Semiconductor Device Using Soi Substrate
Application:
09/786,228 →