IP Library › Assignment 011685/0393
Patent Assignment
Reel/Frame 011685/0393

Assignment of Assignor's Interest

Recorded: 2001-03-30 Pages: 3
Assignors
LEE, JIN YUAN
Executed: 2001-02-28
HUANG, CHING CHENG
Executed: 2001-02-28
LIN, MOU SHIUNG
Executed: 2001-02-28
Assignee
MEGIC CORPORATION
SCIENCE-BASED INDUSTRIAL PARK, 21 R & D FIRST ROAD, HSIN-CHU, R.O.C, TAIWAN
Covered Property (1)
Structure and Manufactruing Method of Chip Scale Package
Patent: 7,498,196 →
Application: 09/821,546 →
Publication: US 2002/0140069
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 3, 2006
From: MEGIC CORPORATION
To: MEGICA CORPORATION
Reel/Frame 017566/0028 →
Merger Sep 25, 2013
From: MEGICA CORPORATION
To: MEGIT ACQUISITION CORP.
Reel/Frame 031283/0198 →
Assignment of Assignor's Interest Jul 11, 2014
From: MEGIT ACQUISITION CORP.
To: QUALCOMM INCORPORATED
Reel/Frame 033303/0124 →