Patent Assignment
Reel/Frame 011710/0227
Assignment of Assignor's Interest
Recorded: 2001-03-29
Pages: 2
Assignors
HUANG, CHIEN PING
Executed: 2001-03-13
HO, TZONG DA
Executed: 2001-03-13
YU, ISAAC
Executed: 2001-03-13
Assignee
SILICONWARE PRECISION INDUSTRIES CO., LTD.
NO. 123, SEC. 3. DA FONG ROAD, TANTZU, TAICHUNG, R.O.C, TAIWAN
Covered Property
(1)
Ball Grid Array Substrate Strip with Warpage-Preventive Linkage Structure