Assignment of Assignor's Interest

Recorded: 2001-04-19 Pages: 3

Assignor

CHOPRA, DINESH

Executed: 2001-04-10

Assignee

MICRON TECHNOLOGY, INC.

8000 SOUTH FEDERAL WAY, BOISE, IDAHO, 83716

Covered Property (1)

Combined Barrier Layer and Seed Layer

Patent: 6,852,618 →

Application: 09/838,493 →

Publication: US 2002/0173137

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.