Patent Assignment
Reel/Frame 011720/0652
Assignment of Assignor's Interest
Recorded: 2001-04-11
Received: 2001-04-27
Pages: 2
Assignor
URUSHIMA, MICHITAKA
Executed: 2001-03-26
Assignee
NEC CORPORATION
7-1, SHIBA 5-CHOME, MINATO-KU, TOKYO, JPX, JAPAN
Covered Property
(1)
Semiconductor Package and Semiconductor Package Fabrication Method
Application:
09/832,095 →