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App. No. 09/832,095 · Confirmation No. 8671

SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE FABRICATION METHOD

Inventor: Michitaka Urushima
Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362 View Patent ↗ View Publication ↗
⬇ PDF
 Code Description Pages PDF
2001-04-11 TRNA Transmittal of New Application 1 View
2001-04-11 SPEC Specification 28 View
2001-04-11 CLM Claims 5 View
2001-04-11 ABST Abstract 1 View
2001-04-11 DRW Drawings-only black and white line drawings 7 View
2001-04-11 OATH Oath or Declaration filed 1 View
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Quick Facts
App. No.
09/832,095
Filed
2001-04-11
Granted
2002-04-16
Pub. No.
US20010034082A1
Art Unit
2813
PTA
0 days