Patent Application
Utility
App. No. 10/073,104
· Confirmation No. 5186
SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE FABRICATION METHOD
Inventor:
Michitaka Urushima
Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2002-02-12 | TRNA |
Transmittal of New Application | 2 | View | |
| 2002-02-12 | A.PE |
Preliminary Amendment | 2 | View | |
| 2002-02-12 | SPEC |
Specification | 28 | View | |
| 2002-02-12 | CLM |
Claims | 5 | View | |
| 2002-02-12 | ABST |
Abstract | 1 | View | |
| 2002-02-12 | DRW |
Drawings-only black and white line drawings | 7 | View | |
| 2002-02-12 | OATH |
Oath or Declaration filed | 1 | View |
Inventors
Michitaka Urushima
Tokyo, JAPAN
Attorneys & Agents of Record
Classification
USPC
438/118
H10W74/012
H10W72/856
H10W90/701
H10W74/15
H10W72/952
H10W70/635
H10W72/90
H10W90/724
H10W72/5522
H10W72/9415
Prosecution
- Examiner
- GEYER, SCOTT B
- Art Unit
- 2829
- Docket No.
- Q68433
- Confirmation No.
- 5186
Foreign Priority
2000-123156
·
2000-04-24
·
JAPAN
Publication
- Pub. No.
- US20020072152A1
- Pub. Date
- 2002-06-13
Patent Term Adjustment
-82days
from
NEC CORPORATION
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2003-02-25
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Quick Facts
- App. No.
- 10/073,104
- Filed
- 2002-02-12
- Granted
- 2003-02-04
- Pub. No.
- US20020072152A1
- Examiner
- GEYER, SCOTT B
- Art Unit
- 2829
- PTA
- -82 days
External Links