Patent Assignment
Reel/Frame 011733/0678
Assignment of Assignor's Interest
Recorded: 2001-04-19
Received: 2001-05-01
Pages: 2
Assignee
IBM CORPORATION
ARMONK, NY, 10504, UNITED STATES
Covered Property
(1)
System on a Package Fabricated on a Semiconductor or Dielectric Wafer with Wiring on One Face, Vias Extending Through the Wafer, and External Connections on the Opposing Face
Application:
09/838,725 →