IP Library Granted Patent US 6,593,644
Granted Patent Utility Small
US 6,593,644 · Confirmation No. 9504

SYSTEM ON A PACKAGE FABRICATED ON A SEMICONDUCTOR OR DIELECTRIC WAFER WITH WIRING ON ONE FACE, VIAS EXTENDING THROUGH THE WAFER, AND EXTERNAL CONNECTIONS ON THE OPPOSING FACE

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Code Description Pages PDF
2014-10-03 IMIS Miscellaneous Internal Document 1 View
2001-04-19 TRNA Transmittal of New Application 1 View
2001-04-19 SPEC Specification 10 View
2001-04-19 CLM Claims 5 View
2001-04-19 ABST Abstract 1 View
2001-04-19 DRW Drawings-only black and white line drawings 2 View
2001-04-19 OATH Oath or Declaration filed 3 View
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Quick Facts
Patent No.
US 6,593,644
App. No.
09/838,725
Filed
2001-04-19
Granted
2003-07-15
Pub. No.
US20020153603A1
Art Unit
2813
PTA
-8 days