Patent Assignment
Reel/Frame 011739/0362
Assignment of Assignor's Interest
Recorded: 2001-04-25
Pages: 3
Assignor
TOLEDANO, ELI
Executed: 2001-04-05
Assignee
KULICKE & SOFFA INVESTMENTS, INC.
300 DELAWARE AVE., SUITE 533, WILMINGTON, DELAWARE, 19801
Covered Property
(1)
Dicing method and apparatus for cutting panels or wafers into rectangular shaped die
Application:
09/841,745 →
Publication:
US 2002/0157657
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.