IP Library › Patent Application 09841745
Patent Application Utility
App. No. 09/841,745 · Confirmation No. 5760

Dicing method and apparatus for cutting panels or wafers into rectangular shaped die

Inventor: Eli Toledano
Abandoned -- Failure to Respond to an Office Action View Publication ↗
⬇ PDF
 Code Description Pages PDF
2001-04-25 TRNA Transmittal of New Application 1 View
2001-04-25 SPEC Specification 8 View
2001-04-25 CLM Claims 5 View
2001-04-25 ABST Abstract 1 View
2001-04-25 DRW Drawings-only black and white line drawings 5 View
2001-04-25 OATH Oath or Declaration filed 2 View
2001-04-25 LET. Miscellaneous Incoming Letter 1 View
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this application's details
Quick Facts
App. No.
09/841,745
Filed
2001-04-25
Pub. No.
US20020157657A1
Art Unit
3723