Patent Assignment
Reel/Frame 011739/0443
Assignment of Assignor's Interest
Recorded: 2001-04-12
Received: 2001-05-02
Pages: 2
Assignee
SHOWA DENKO KABUSHIKI KAISHA
13-9, SHIBA DAIMON 1-CHOME, MINATO-KU, TOKYO 105-8518, JPX, JAPAN
Covered Property
(1)
Abrasive Composition for Polishing Semiconductor Device and Method for Producing Semiconductor Device Using the Same
Application:
09/832,793 →