IP Library › Granted Patent US 6,733,553
Granted Patent Utility
US 6,733,553 · Confirmation No. 1438

ABRASIVE COMPOSITION FOR POLISHING SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE USING THE SAME

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2004-04-01 IFEE Issue Fee Payment (PTO-85B) 1 View
2003-09-25 IDS Information Disclosure Statement (IDS) Form (SB08) 4 View
2003-09-25 FOR Foreign Reference 4 View
2003-09-25 FOR Foreign Reference 5 View
2003-09-25 LET. Miscellaneous Incoming Letter 1 View
2003-09-05 PRO TRANS Translation of a provisional application filed with a non-provisional 1 View
2003-09-05 LET. Miscellaneous Incoming Letter 2 View
2001-11-15 TRNA Transmittal of New Application 2 View
2001-11-15 SPEC Specification 27 View
2001-11-15 CLM Claims 5 View
2001-11-15 ABST Abstract 1 View
2001-11-15 DRW Drawings-only black and white line drawings 1 View
2001-04-12 TRNA Transmittal of New Application 1 View
2001-04-12 SPEC Specification 18 View
2001-04-12 DRW Drawings-only black and white line drawings 1 View
2001-04-12 OATH Oath or Declaration filed 3 View
2001-04-12 LET. Miscellaneous Incoming Letter 1 View
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Quick Facts
Patent No.
US 6,733,553
App. No.
09/832,793
Filed
2001-04-12
Granted
2004-05-11
Pub. No.
US20020059755A1
Art Unit
1755
PTA
-92 days