Patent Assignment
Reel/Frame 034035/0134
Assignment of Assignor's Interest
Recorded: 2014-10-27
Pages: 4
Assignor
SHOWA DENKO K.K.
Executed: 2014-09-30
Assignee
HITACHI CHEMICAL COMPANY, LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Properties
(9)
Polishing Composition for Chemical Mechanical Polishing
Patent:
5,800,577 →
Application:
08/895,954 →
Polishing material composition and polishing method for polishing LSI devices
Patent:
6,299,659 →
Application:
09/564,205 →
Cerium Oxide Slurry for Polishing, Process for Preparing the Slurry, and Process for Polishing with the Slurry
Patent:
6,478,836 →
Application:
09/578,481 →
Composition for Polishing a Semiconductor Device and Process for Manufacturing a Semiconductor Device Using the Same
Patent:
6,436,835 →
Application:
09/622,939 →
Abrasive Composition for Polishing Semiconductor Device and Method for Producing Semiconductor Device Using the Same
Composition for Polishing a Semiconductor Device and Process for Manufacturing a Semiconductor Device Using the Same
Cerium Oxide Slurry for Polishing, Process for Preparing the Slurry, and Process for Polishing with the Slurry
Polishing Composition And Polishing Method
Polishing Composition
Related Assignments
(4)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
May 3, 2010
From: SATO, TAKASHI; TAKAHASHI, HIROSHI; SHIMAZU, YOSHITOMO; ITOH, YUJI
To: SHOWA DENKO K.K.
Reel/Frame 024326/0526 →
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →