Granted Patent
Utility
US 6,410,444
· Confirmation No. 6235
COMPOSITION FOR POLISHING A SEMICONDUCTOR DEVICE AND PROCESS FOR MANUFACTURING A SEMICONDUCTOR DEVICE USING THE SAME
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2001-09-17 | TRNA |
Transmittal of New Application | 2 | View | |
| 2001-09-17 | A.PE |
Preliminary Amendment | 3 | View | |
| 2001-09-17 | SPEC |
Specification | 17 | View | |
| 2001-09-17 | CLM |
Claims | 2 | View | |
| 2001-09-17 | ABST |
Abstract | 1 | View | |
| 2001-09-17 | DRW |
Drawings-only black and white line drawings | 1 | View | |
| 2001-09-17 | OATH |
Oath or Declaration filed | 4 | View |
Inventors
Takanori Kido
Shiojiri-shi, JAPAN
Kagetaka Ichikawa
Shiojiri-shi, JAPAN
Classification
USPC
438/693
H10P95/062
C09K3/14
C09K3/1463
Prosecution
- Examiner
- HOANG, QUOC DINH
- Art Unit
- 2818
- Docket No.
- Q66211
- Confirmation No.
- 6235
Foreign Priority
10-42288
·
1998-02-24
·
JAPAN
Publication
- Pub. No.
- US20020045350A1
- Pub. Date
- 2002-04-18
Patent Term Adjustment
-104days
from
SHOWA DENKO K.K.
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2014-10-27
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Quick Facts
- Patent No.
- US 6,410,444
- App. No.
- 09/953,127
- Filed
- 2001-09-17
- Granted
- 2002-06-25
- Pub. No.
- US20020045350A1
- Examiner
- HOANG, QUOC DINH
- Art Unit
- 2818
- PTA
- -104 days
External Links